Tin 1.0mm 25g 99,3%Sn 0,7%Cu + flux MTL568
Lead-free solder - diameter 1.0 mm, weight 25 g, composition Sn99.3 / Cu0.7 / Ni, flux-cored solder filled with active rosin, suitable for soldering even oxidised surfaces, nickel additive increases the strength of the solder joint, usable in electrical engineering and electronics for manual soldering of THT and SMD components
In stock 9 pcs
Expected shipping:
29.09.2026
Regular price
€4,02
Unit price
/
Unavailable
NUBA | SKU:
06550462
Product description
Tubular lead-free solder filled with active rosin, suitable for normal soldering and oxidized surfaces. The solder can be used in electrical engineering and for less demanding work in electronics.
Technical parameters:
Diameter: 1.0mm
Weight: approx. 25g
Ratio: Sn99.3Cu0.7Nip
Technical parameters:
Diameter: 1.0mm
Weight: approx. 25g
Ratio: Sn99.3Cu0.7Nip

